Dear Valued Customer,

It is well understood by the semiconductor process engineer that complex technologies need advanced instrumentation to control, to monitor, to analyze, so that the final product conforms to the tight specifications set forth while also keeping a watchful eye on maximizing yield.

With this synopsis of a vacuum chamber and the many instruments that can be used in various phases of the PVD process, we depict at a glance the many key components that are often needed to manage process conditions. The synopsis deals predominantly with the Horiba range of instrumentation, but xtronix is also involved in several other phases of the PVD or epi processes as well as the Metrology Tools for monitoring / mapping specific surface related data such as:

• Deposited Films: Thickness & composition of gate oxide, oxynitride, high-k, metal, barrier and cap layers, interconnect structures.
• Implant dose matching, junction depth measurement, process development (characterization of implant, deposited layers, annealing,...) and failure analysis.
• Depth Profiling with high sensitivity (down to ppb atomic concentration) and 2D or 3D imaging of trace elements. Widely used for dopant implant dose matching, junction depth measurement, process development (characterization of implant, deposition, annealing,...), failure and light element analysis.

click on the product photograph for further information