It is well understood by
the semiconductor
process engineer that
complex technologies
need advanced
instrumentation to
control, to monitor, to
analyze, so that the
final product conforms
to the tight
specifications set forth
while also keeping a
watchful eye on
maximizing yield.
With this synopsis of a vacuum chamber and the many instruments
that can be used in various phases of the PVD process, we
depict at a glance the many key components that are often needed to
manage process conditions.
The synopsis deals predominantly with the Horiba range of
instrumentation.
xtronix is also involved in several other phases of the PVD or
epi processes as well as the Metrology Tools for monitoring /
mapping specific surface related data such as:
Deposited Films: Thickness & composition of gate oxide,
oxynitride, high-k, metal, barrier and cap layers, interconnect
structures.
Implant dose matching, junction depth measurement, process
development (characterization of implant, deposited layers,
annealing,...) and failure analysis.
Depth Profiling with high sensitivity (down to ppb atomic
concentration) and 2D or 3D imaging of trace elements. Widely
used for dopant implant dose matching, junction depth
measurement, process development (characterization of implant,
deposition, annealing,...), failure and light element analysis
click on the product photograph for further information.
